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Tannic acid tailored-made microsystems for wound infection

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  • معلومة اضافية
    • Contributors:
      Veritati - Repositório Institucional da Universidade Católica Portuguesa
    • بيانات النشر:
      MDPI, 2023.
    • الموضوع:
      2023
    • نبذة مختصرة :
      Difficult-to-treat infections make complex wounds a problem of great clinical and socio-economic impact. Moreover, model therapies of wound care are increasing antibiotic resistance and becoming a critical problem, beyond healing. Therefore, phytochemicals are promising alternatives, with both antimicrobial and antioxidant activities to heal, strike infection, and the inherent microbial resistance. Hereupon, chitosan (CS)-based microparticles (as CM) were designed and developed as carriers of tannic acid (TA). These CMTA were designed to improve TA stability, bioavailability, and delivery in situ. The CMTA were prepared by spray dryer technique and were characterized regarding encapsulation efficiency, kinetic release, and morphology. Antimicrobial potential was evaluated against methicillin-resistant and methicillin-sensitive Staphylococcus aureus (MRSA and MSSA), Staphylococcus epidermidis, Escherichia coli, Candida albicans, and Pseudomonas aeruginosa strains, as common wound pathogens, and the agar diffusion inhibition growth zones were tested for antimicrobial profile. Biocompatibility tests were performed using human dermal fibroblasts. CMTA had a satisfactory product yield of ca. 32% and high encapsulation efficiency of ca. 99%. Diameters were lower than 10 μm, and the particles showed a spherical morphology. The developed microsystems were also antimicrobial for representative Gram+, Gram−, and yeast as common wound contaminants. CMTA improved cell viability (ca. 73%) and proliferation (ca. 70%) compared to free TA in solution and even compared to the physical mixture of CS and TA in dermal fibroblasts.
    • File Description:
      application/pdf
    • ISSN:
      1422-0067
      1661-6596
    • Rights:
      OPEN
    • الرقم المعرف:
      edsair.doi.dedup.....8eefffaeee39f3e0db6968a31ddf3d5a