Item request has been placed!
×
Item request cannot be made.
×
Processing Request
Wafer Level Packaging of Compound Semiconductors.
Item request has been placed!
×
Item request cannot be made.
×
Processing Request
- المؤلفون: Strandjord, Andrew; Teutsch, Thorsten; Scheffler, Axel; Otto, Bernd; Paat, Anna; Alinabon, Oscar; Jing Li
- المصدر:
Journal of Microelectronic & Electronic Packaging. 2010 3rd Quarter, Vol. 7 Issue 3, p152-159. 8p. 9 Color Photographs, 5 Black and White Photographs, 11 Diagrams, 3 Charts, 8 Graphs.
No Comments.