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Deformations of a simplified flip chip structure under thermal testing inspected using a real-time Moiré technique.

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  • المؤلفون: Zhong, Z.W.1 ; Wong, K.W.1; Shi, X.Q.2
  • المصدر:
    International Journal of Advanced Manufacturing Technology. Jan2006, Vol. 27 Issue 7/8, p708-714. 7p. 2 Black and White Photographs, 2 Diagrams, 10 Graphs.